Tiburcio A Maldo

Title: Innovations of Tiburcio A Maldo

Introduction

Tiburcio A Maldo is a notable inventor based in Cebu, Philippines. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

One of his latest patents is the "Solderless and Pressure Contact Connection." This invention features a pressure contact assembly that includes a power substrate, a chip, and a lead. The power substrate is connected to a ceramic tile and has a cavity. The chip is soldered to the surface, while the lead is designed to be inserted into the cavity, connecting to an external device.

Another significant patent is the "Leadframeless Electrically Isolated Power Semiconductor Package." This lead-free power semiconductor package includes a substrate, multiple copper leads, a die, and an encapsulant. The substrate consists of alternating layers of copper and silicon nitride. The copper leads, which are not part of a leadframe, are connected to the substrate using active metal brazing. The die contains circuitry that allows the power semiconductor package to operate, and it is connected to the substrate using silver sintered paste. The encapsulant encases both the substrate and the die, with some leads extending outside the encapsulant.

Career Highlights

Tiburcio A Maldo is currently employed at Littelfuse, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of power semiconductor packages.

Collaborations

He collaborates with talented coworkers, including Jeff Grozen and Rhodri Hughes, who contribute to the innovative environment at Littelfuse, Inc.

Conclusion

Tiburcio A Maldo's contributions to semiconductor technology through his patents demonstrate his commitment to innovation. His work not only enhances electronic components but also paves the way for future advancements in the field.