The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2025
Filed:
Jul. 14, 2022
Littelfuse, Inc., Chicago, IL (US);
Tiburcio A. Maldo, Cebu, PH;
Rhodri Hughes, Swindon, GB;
Robert Ebido, Batangas, PH;
Jeff Grozen, Muntinlupa, PH;
Josef Colquin A. Chua, Batangas, PH;
Domingo Atienza, Jr., Batangas, PH;
Littelfuse, Inc., Chicago, IL (US);
Abstract
A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. The clip is attached to the power substrate and has a foot at one end and a recessed area at the other, opposite end. The foot is connected to the power substrate. The trimetal has a base, a trapezoid structure, and a clip portion. The base is soldered to the chip. The trapezoid structure is located above the base. The clip portion is located above the trapezoid structure and includes a projecting area. The recessed area of the clip fits into the projecting area of the trimetal.