The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2025
Filed:
Jul. 12, 2022
Applicant:
Littelfuse, Inc., Chicago, IL (US);
Inventors:
Tiburcio A Maldo, Cebu, PH;
Rhodri Hughes, Swindon, GB;
Robert Ebido, Batangas, PH;
Jeff Grozen, Muntinlupa, PH;
Josef Colquin A. Chua, Batangas, PH;
Domingo Atienza, Jr., Batangas, PH;
Assignee:
Littelfuse, Inc., Rosemont, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 21/4853 (2013.01); H01L 24/32 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the cavity and has a top portion to connect to an external device and a bottom portion to fit into the cavity.