Hefei, China

Tiansong Pu

This inventor holds 1 USPTO granted patent. Top assignee: Nexchip Semiconductor Corporation. Active years: 2019.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Tiansong Pu: Innovator in Silicon Island Structures

Introduction

Tiansong Pu is a notable inventor based in Hefei, China. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to silicon island structures. His work is instrumental in advancing the efficiency and cost-effectiveness of semiconductor fabrication processes.

Latest Patents

Tiansong Pu holds a patent for a "Silicon island structure and method of fabricating same." This patent describes a method that includes forming multiple first trenches in a silicon substrate and creating second trenches by partially filling some of the first trenches with an insulating material. The process involves several steps, including depositing a protective layer, oxidizing portions of the silicon substrate, and filling the second trenches with isolating material to form silicon islands. This method enables the formation of silicon islands at desired locations with reduced process complexity and cost. He has 1 patent to his name.

Career Highlights

Tiansong Pu is currently associated with Nexchip Semiconductor Corporation, where he applies his expertise in semiconductor technology. His innovative approach has contributed to the development of advanced semiconductor structures, enhancing the capabilities of modern electronics.

Collaborations

He has collaborated with notable colleagues, including Ching-Ming Lee and Hsin-Chuan Chen, to further his research and development efforts in the semiconductor industry.

Conclusion

Tiansong Pu's contributions to the field of semiconductor technology, particularly through his patent on silicon island structures, highlight his role as an innovator. His work continues to influence the efficiency and cost-effectiveness of semiconductor fabrication processes.

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