This inventor holds 1 USPTO granted patent. Top assignee: Visera Technologies Company Limited. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Innovations of Tian-Wen Liao in Photoresist Removal Technology.
Introduction
Tian-Wen Liao is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of photoresist removal technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of wafer processing.
Latest Patents
Tian-Wen Liao holds a patent for an "Apparatus and method for removing photoresist layer from alignment mark." This invention provides a solution for removing a photoresist layer from at least one alignment mark of a wafer. The apparatus includes a holder to support the wafer, a solvent dispenser to spray solvent onto the photoresist layer, and a suction unit to remove the dissolved photoresist layer and solvent from the wafer.
Career Highlights
Tian-Wen Liao is currently associated with Visera Technologies Company Limited, where he continues to innovate and develop new technologies. His work has been instrumental in improving the processes involved in semiconductor manufacturing.
Collaborations
He has collaborated with notable colleagues such as Yuan-Chun Chao and Wei-Chuan Chen, contributing to advancements in their respective fields.
Conclusion
Tian-Wen Liao's contributions to photoresist removal technology exemplify the impact of innovative thinking in the semiconductor industry. His patent reflects a commitment to enhancing manufacturing processes and improving efficiency.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile