Thomas Spöttl

Title: Thomas Spöttl: Innovator in Semiconductor Technology

Introduction

Thomas Spöttl is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to chip modules and encapsulation methods.

Latest Patents

One of his latest patents is for a chip module that features a chip mounted with adhesive on a substrate. This chip is electrically connected to contact pads via bonding wires, and it is surrounded by an encapsulation compound that is both radiation-hardened and heat-hardened. This compound includes radiation-impermeable pigments, enhancing the durability and functionality of the chip. Another significant patent involves a semiconductor chip and a method for producing housing. This method allows for selective encapsulation that covers connection pads and bonding wires while leaving active regions free, particularly for fingerprint sensors. The adaptation of the chip surface through varying roughness or coating, along with the alteration of potting compound viscosity via irradiation, highlights his innovative techniques.

Career Highlights

Throughout his career, Thomas Spöttl has worked with prominent companies in the semiconductor industry, including Infineon Technologies AG and Delo Industrie Klebstoffe GmbH & Co. KG. His experience in these organizations has contributed to his expertise and the development of his patented technologies.

Collaborations

Thomas has collaborated with notable professionals in his field, including Hans-Georg Mensch and Frank Puschner. These collaborations have likely enriched his work and led to advancements in semiconductor technology.

Conclusion

Thomas Spöttl is a distinguished inventor whose work in semiconductor technology has led to innovative patents that enhance chip functionality and durability. His contributions continue to impact the industry positively.