The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2008
Filed:
Aug. 16, 2005
Applicants:
Frank Puschner, Kelheim, DE;
Dietmar Dengler, Landsberg, DE;
Wolfgang Schindler, Regenstauf, DE;
Thomas Spottl, Regensburg, DE;
Inventors:
Frank Puschner, Kelheim, DE;
Dietmar Dengler, Landsberg, DE;
Wolfgang Schindler, Regenstauf, DE;
Thomas Spottl, Regensburg, DE;
Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.