Location History:
- Landsberg, DE (2001 - 2008)
- Seestall, DE (2015)
Company Filing History:
1 out of 1 
1 out of 2 
1 out of 9 
Years Active: 2001-2015
Title: Dietmar Dengler: Innovator in Adhesives and Encapsulation Technologies
Introduction
Dietmar Dengler is a notable inventor based in Landsberg, Germany. He has made significant contributions to the field of adhesives and encapsulation technologies, holding a total of 4 patents. His work focuses on developing innovative materials that enhance the performance and reliability of electronic components.
Latest Patents
Dengler's latest patents include a dual curing composition and a chip module. The dual curing composition relates to combined radiation- and moisture-curing compounds, which are characterized by rapid curing through moisture. These compounds are particularly useful as adhesives, coatings, or potting materials, with a preferred application in filling electro-optical components. The chip module patent describes a chip mounted with adhesive on a substrate, electrically connected via bonding wires to contact pads. This module features an encapsulation compound that surrounds the chip and bonding wires, which is both radiation-hardened and heat-hardened, incorporating radiation-impermeable pigments.
Career Highlights
Throughout his career, Dengler has worked with prominent companies in the adhesive industry, including Delo Industrieklebstoffe GmbH & Co. KG. His expertise in developing advanced materials has positioned him as a key player in the field.
Collaborations
Dengler has collaborated with notable professionals such as Gunther Eckhardt and Ursula Somnitz, contributing to the advancement of adhesive technologies.
Conclusion
Dietmar Dengler's innovative work in adhesives and encapsulation technologies has led to significant advancements in the field. His patents reflect a commitment to enhancing the performance of electronic components through cutting-edge materials.