Infineon Technologies Ag

Delo Industrie Klebstoffe Gmbh & Co. Kgaa

Delo Industrieklebstoffe Gmbh & Co. Kg

Delo Industire Klebstoffe Gmbh + Co. Kg

Delo Industrieklebstoffe Gmbh Co. K

Dietmar Dengler

Gunther Eckhardt

Wolfgang Schindler

Frank Puschner

Markus True

Michael Stumbeck

Robert Born

Ursula Somnitz

The invention relates to combined radiation- and moisture-curing compounds, which are characterized in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the compounds according to the invention is particularly preferred for filling electro-optical components.

Dual curing composition and use thereof

A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.

Chip module

Cationically hardening masses are described, which can be stored and handled as single-component masses and comprise at least one difunctional cationically polymerizable compound; a photo-initiator for the cationic hardening based upon diaryliodonium salts; at least one compound containing an hydroxyl group; a compound releasing radicals when heated and having a half-life of one hour at a temperature of less than 100&deg; C.; a photo-initiator forming radicals or of a photo-sensitizing agent for diaryliodonium salts; and from 0 to 60 parts by mass of modifier. The compounds are used for bonding, casting, sealing and coating of substrates.

Cationically hardening mass, the use thereof and process for preparing hardened polymer masses

A polymerizable fluorine-containing composition is proposed, containing at least one polymerizable compound and at least one fluorine-containing compound, which for reducing the content of fluoride ions extractable with water of cured polymer masses obtainable from the composition additionally contains at least one magnesium compound. The composition is particularly suitable for bonding, potting and coating of electronic devices and for mounting electronic devices on printed circuit boards. Further proposed is a process for the preparation of cured polymer masses having a reduced content of fluoride ions extractable with water, comprising polymerizing and curing the composition to which at least one magnesium compound is added prior to the polymerization.

Polymerizable fluorine-containing composition, use thereof, and process for the preparation of cured polymer masses from said composition

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Landsberg, Germany

Dietmar Dengler