Sussex, WI, United States of America

Thomas Lee Ruppert



 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017-2020

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2 patents (USPTO):Explore Patents

Title: Thomas Lee Ruppert: Innovator in Heat Seal Coating Technology

Introduction

Thomas Lee Ruppert is a notable inventor based in Sussex, WI (US). He has made significant contributions to the field of packaging technology, particularly in the development of low temperature heat seal coatings. With a total of 2 patents to his name, Ruppert's innovations are paving the way for more efficient packaging solutions.

Latest Patents

Ruppert's latest patent focuses on a solvent-based low temperature heat seal coating. This innovative solution contains an amorphous or semi-crystalline polyester or co-polyester resin, tackifier, anti-blocking agent, and solvent. The coating can be applied to packaging webs such as foil or film using conventional methods like gravure, rod, slot die, or printing processes. The heat seal coating can be sealed to itself or another substrate, making it ideal for manufacturing food packaging bags or pharmaceutical blister packaging. Remarkably, the heat seal temperature can be as low as 70°C under standard industry equipment and conditions.

Career Highlights

Ruppert is currently employed at Bostik, Inc., where he continues to innovate in the field of packaging materials. His work has been instrumental in enhancing the efficiency and effectiveness of heat seal coatings, which are crucial for various packaging applications.

Collaborations

Throughout his career, Ruppert has collaborated with talented individuals such as Darius K Deak and Elaine Lo. These collaborations have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Thomas Lee Ruppert is a distinguished inventor whose work in low temperature heat seal coatings is making a significant impact in the packaging industry. His innovative solutions are not only improving packaging efficiency but also setting new standards for the industry.

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