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For the Inventor, By the Inventor

Radebeul, Germany

Thomas Herrmann

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Globalfoundries Inc.. Active years: 2018-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Thomas Herrmann. Retrieved from https://idiyas.com/inventor/thomas-herrmann-w87j89tv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 5.9

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:

goldMedal3 out of 5,671 
 
Globalfoundries Inc.
 patents

Years Active: 2018-2019

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3 patents (USPTO):Explore Patents
1. 10191112 - Early development of a database of fail signatures for systematic defects in integrated circuit (IC) chips (2019-01-29),
2. 10095826 - Feed-forward for silicon inspections (DFM2CFM : design to silicon) and feed-back for weakpoint predictor decks (CFM2DFM : silicon to design) guided by marker classification, sampling, and higher dimensional analysis (2018-10-09),
3. 9898572 - Metal line layout based on line shifting (2018-02-20),

Title: Innovations by Thomas Herrmann

Introduction

Thomas Herrmann is an accomplished inventor based in Radebeul, Germany. He has made significant contributions to the field of integrated circuit (IC) technology. With a total of 3 patents to his name, Herrmann's work focuses on enhancing the reliability and efficiency of IC chips.

Latest Patents

One of Herrmann's latest patents involves the early development of a database of fail signatures for systematic defects in IC chips. This method provides for pre-production run development of a fail signature database, which stores fail signatures for systematic defects and their corresponding root causes. The fail signatures in the database are accessed and utilized for various purposes, such as evaluating the signatures to prevent specific systematic defects during production runs. Additionally, new fail signatures from failing production chips are developed and compared against the existing database to enhance production quality.

Another notable patent by Herrmann is related to feed-forward for silicon inspections and feedback for weak point predictor decks. This method and apparatus select silicon wafers based on individual or multiple design for manufacturability (DFM) decks for analysis. The process includes generating markers for a wafer, determining candidate markers for weak point prediction, and performing UCF-Index-based sampling to ensure quality control in silicon production.

Career Highlights

Thomas Herrmann is currently employed at GlobalFoundries Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in IC chips, contributing to the overall efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Herrmann has collaborated with talented professionals such as Shikha Somani and Sriram Madhavan. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Thomas Herrmann's contributions to the field of integrated circuits through his innovative patents demonstrate his expertise and commitment to advancing technology. His work not only enhances the production processes but also ensures the reliability of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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