The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 29, 2019

Filed:

Nov. 18, 2016
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Rao Desineni, Malta, NY (US);

Atul Chittora, Clifton Park, NY (US);

Yan Pan, Clifton Park, NY (US);

Sherwin Fernandes, Clifton Park, NY (US);

Thomas Herrmann, Radebeul, DE;

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/317 (2006.01); G01R 31/3177 (2006.01);
U.S. Cl.
CPC ...
G01R 31/31703 (2013.01); G01R 31/3177 (2013.01); G01R 31/31718 (2013.01);
Abstract

Disclosed are embodiments of a method that provides for pre-production run development of a fail signature database, which stores fail signatures for systematic defects and corresponding root causes. The fail signatures in the database is subsequently accessed and used for a variety of purposes. For example, the fail signatures are evaluated and, based on the results of the evaluation, actions are taken to prevent specific systematic defects from occurring during production runs and/or to allow for early detection of specific systematic defects during production runs. In some embodiments, following production runs, new fail signatures from failing production chips are developed and compared against the fail signatures in the fail signature database. In some embodiments, when a signature match indicates that a particular production chip has a same systematic defect with a same root cause as a particular prototype chip in-line advanced process control (APC) is performed.


Find Patent Forward Citations

Desineni, Rao. (2019). Early development of a database of fail signatures for systematic defects in integrated circuit (ic) chips (U.S. Patent No. 10191112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10191112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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