Company Filing History:
Years Active: 2005
Title: Thomas B Blount: Innovator in Integrated Circuit Packaging
Introduction
Thomas B Blount is a notable inventor based in San Jose, CA. He has made significant contributions to the field of integrated circuit packaging. With a focus on innovative solutions, he has been awarded 2 patents for his groundbreaking work.
Latest Patents
His latest patents include a high-density chip-level package for the packaging of integrated circuits and a method to manufacture the same. This package is designed for mounting an integrated circuit die and features a metal substrate with opposing primary surfaces and an aperture formed between them. A flexible thin film interconnect structure is created over the first surface of the metal substrate and the aperture. This structure includes a first dielectric layer, a first metalization layer with signal lines and bonding pads, and a second plurality of bonding pads on the top surface. The design allows for efficient attachment of the integrated circuit die to the package.
Career Highlights
Thomas B Blount is currently associated with Kulicke and Soffa Investments, Inc., where he continues to innovate in the field of integrated circuits. His work has been instrumental in advancing packaging technologies that enhance the performance and reliability of electronic devices.
Collaborations
He has collaborated with notable coworkers such as Jan I Strandberg and Richard Scott Trevino, contributing to a dynamic work environment that fosters innovation.
Conclusion
Thomas B Blount's contributions to integrated circuit packaging exemplify the spirit of innovation in technology. His patents reflect a commitment to advancing the field and improving electronic device performance.