This inventor holds 1 USPTO granted patent. Top assignee: Amkor Technology, Inc.. Active years: 2018.
Company Filing History:
Years Active: 2018
Title: Innovations by Thinh Van Pham in Semiconductor Packaging
Introduction
Thinh Van Pham is an accomplished inventor based in Austin, TX. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative methods and designs. His work is particularly focused on enhancing the performance and efficiency of semiconductor devices.
Latest Patents
Thinh Van Pham holds a patent for a "Method of forming a semiconductor package with conductive interconnect frame and structure." This patent describes a method that includes providing a conductive frame structure, which consists of a first frame with leadfingers designed for direct attachment to a semiconductor device. The leadfingers are engineered to support high current capacity and thermal dissipation, crucial for power devices within the semiconductor. Additionally, the conductive frame structure may include a second frame with leads that connect to low power device portions, encapsulated within a package body.
Career Highlights
Thinh Van Pham is currently employed at Amkor Technology, Inc., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, particularly in terms of performance and reliability.
Collaborations
Thinh has collaborated with various professionals in his field, including his coworker Marc Alan Mangrum. Their combined expertise contributes to the innovative projects at Amkor Technology, Inc.
Conclusion
Thinh Van Pham's contributions to semiconductor packaging through his patented methods highlight his role as a key innovator in the industry. His work not only enhances the functionality of semiconductor devices but also sets a foundation for future advancements in technology.