Munich, Germany

Thilo Egner

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Ebm-Papst Mulfingen Gmbh & Co Kg. Active years: 2012.


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Thilo Egner: Innovator in Power Component Technology

Introduction

Thilo Egner is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electronic circuit cooling through his innovative designs. His work focuses on enhancing the efficiency and reliability of power components in electronic devices.

Latest Patents

Thilo Egner holds a patent for a clamping part designed for pressing power components against a cooling surface. This invention relates to a clamping member that effectively secures power components against the cooling flanges of a housing, particularly for electronic circuits. The clamping member features a housing frame with a receiving chamber for both the cooling flange and the power semiconductor. A pressure element is strategically placed to ensure that the power component is pressed firmly against the cooling flange, optimizing thermal management in electronic applications. He has 1 patent to his name.

Career Highlights

Thilo Egner is currently employed at Ebm-Papst Mulfingen GmbH & Co. KG, a leading company in the field of ventilation and drive technology. His role involves developing innovative solutions that enhance the performance of electronic components. His expertise in thermal management has positioned him as a key player in the industry.

Collaborations

Thilo has collaborated with several talented individuals, including Dieter Best and Mark Heinze. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Thilo Egner's contributions to the field of power component technology demonstrate his commitment to innovation and excellence. His patent for a clamping part showcases his ability to solve complex engineering challenges. Through his work at Ebm-Papst Mulfingen GmbH & Co. KG, he continues to influence the future of electronic circuit design.

Profile summary based on public USPTO records.
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