The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2012

Filed:

Mar. 02, 2010
Applicants:

Dieter Best, Ingelfingen, DE;

Mark Heinze, Rot am See, DE;

Erich Fiedler, Neusitz, DE;

Thilo Egner, Ingelfingen-Stachenhausen, DE;

Inventors:

Dieter Best, Ingelfingen, DE;

Mark Heinze, Rot am See, DE;

Erich Fiedler, Neusitz, DE;

Thilo Egner, Ingelfingen-Stachenhausen, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); F04B 35/04 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a clamping member for pressing power components () against cooling surfaces of the cooling flanges () of a housing, particularly for receiving an electronic circuit. The clamping member comprises a housing frame () having at least one receiving chamber for the cooling flange () and the power semiconductor () to be contacted with the cooling flange (), the receiving chamber being surrounded by the frame walls () of the housing frame. A pressure element () is disposed between a frame wall () and the power component () disposed opposite thereof, or the cooling flange () disposed opposite thereof. A separating gap, into which an expanding element () can be introduced on one side non-positively and/or positively such that the power component () is pressed against the cooling flange (), is provided between the pressure element () and the frame wall ().


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