Theodore Joseph Sattler

Title: Theodore Joseph Sattler: Semiconductor Packaging Inventor

Introduction

Theodore Joseph Sattler is an inventor associated with Easton, Pennsylvania, United States. His work includes innovations in semiconductor packaging and package fabrication. He holds 2 patents.

Latest Patents

Sattler’s listed patents address two aspects of packaging integrated circuits:

- **Ball grid array plastic package.** This invention describes a laminated plastic package with a cavity that holds an integrated circuit unit, which is enclosed in an organic polymer such as epoxy. The substrate has metal patterns on both sides, plated vias connecting those patterns, and a grid of electrical contact pads. A structural member reinforces the laminate and helps protect the integrated circuit after encapsulation. The disclosure also covers a method for making the package and a laminate designed for its assembly.

- **Fabrication of leaded packages.** This invention describes a fabrication method that protects package leads during processing. Special carriers shield the leads from loads that could otherwise damage them.

Career Highlights

Sattler’s listed company affiliations include Lucent Technologies Inc. His patent work reflects a focus on package structures, electrical connections, and manufacturing methods intended to protect components during assembly and processing.

Collaborations

The supplied information identifies George Addis Baxter and Lakshmendra S. Saxena as Sattler’s coworkers.

Conclusion

Theodore Joseph Sattler’s two patents document contributions to semiconductor packaging, including a reinforced ball grid array package and a process for protecting leads during fabrication.