Other

Lucent Technologies Inc.

Theodore Joseph Sattler

Charles Cohn

George Addis Baxter

Leon Lubranski

Lakshmendra S Saxena

A pad grid array plastic package includes a laminated plastic body with a centrally located cavity, an IC unit secured within the cavity, and an encapsulating organic polymer, such as epoxy, enclosing the cavity. The laminated body includes a substrate and a structural member on top of the substrate and having a centrally located aperture forming the cavity. The substrate is provided with metal patterns on both planar surfaces thereof, through-plated vias electrically connecting the metal patterns, and a grid array of contact pads on the bottom surface of the substrate, electrically connected to the metal pattern. The structural member provides strength and rigidity to the laminate and is sufficiently thick to enable protection of the IC unit when the cavity is enclosed with the encapsulating polymer. Also disclosed is a method of making the package and a laminate with the cavity, metal patterns and grid pad array for use in assembling the package.

Ball grid array plastic package

Disclosed is a method of fabricating leaded packages, including protection of the leads during various processing steps. The packages are mounted in special carriers such that the leads are shielded from loads which might otherwise cause damage to the leads.

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Easton, PA, United States of America

Theodore Joseph Sattler