Thanh Lequang

Title: Innovations of Inventor Thanh Lequang in Semiconductor Packaging

Introduction

Thanh Lequang is an accomplished inventor based in San Jose, California, known for his significant contributions to the field of semiconductor packaging. With two patents to his name, Lequang's work focuses on improving the manufacture and structure of chip scale packages and land grid array packages, enhancing the efficiency and functionality of integrated circuits.

Latest Patents

Lequang's latest patents include innovative techniques designed to advance semiconductor packaging. One of his patents relates to chip scale and land grid array semiconductor packages, detailing methods for patterning a conductive substrate. This method employs a metallic barrier layer and a secondary metallic layer as etching resist, facilitating the formation of packaged semiconductor devices. Additional innovations in this patent cover the use of etch-resistant caps for these layers and techniques for treating a conductive leadframe using CZ treatments, along with solutions for locking grooves within studded leadframes.

Another of Lequang's notable patents features improved substrate structures and fabrication techniques for integrated circuit packaging. This includes a substrate strip fabrication method that allows for efficient strip testing of the dice mounted on it, particularly effective with electrolytically plated landings. His design incorporates multiple distinct molding area tiles with a two-dimensional array of substrate segments, each equipped with an area for die attachment, landing surfaces, and contact pads, minimizing the need for extended routing traces for electrical coupling.

Career Highlights

Thanh Lequang has made a remarkable impact at National Semiconductor Corporation, leveraging his expertise to innovate within the semiconductor industry. His patents not only reflect technical proficiency but also a vision for enhancing manufacturing processes in semiconductor device packaging.

Collaborations

Throughout his career, Lequang has collaborated with notable colleagues, including Shaw Wei Lee and Wayne W Lee. These partnerships have undoubtedly contributed to the advancement of semiconductor technologies and the successful implementation of Lequang's inventive concepts.

Conclusion

In conclusion, Thanh Lequang stands out as a notable inventor in the realm of semiconductor packaging, with two significant patents that showcase his innovative approaches to manufacturing. His contributions to the industry through National Semiconductor Corporation and collaborative efforts highlight his role in shaping the future of integrated circuit technology.