Ageo, Japan

Teturoh Satoh

This inventor holds 3 USPTO granted patents. Top assignee: Mitsui Minings & Melting Co., Ltd.. Active years: 1997-1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teturoh Satoh. Retrieved from https://idiyas.com/inventor/teturoh-satoh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 1997-1999

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3 patents (USPTO):Explore Patents

Title: The Innovations of Teturoh Satoh

Introduction

Teturoh Satoh is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of multilayer printed wiring boards. With a total of 3 patents to his name, Satoh's work has advanced the technology used in electronic circuits.

Latest Patents

Satoh's latest patents include a multilayer printed wiring board that features circuits on both faces of a substrate. This innovative design incorporates insulating layers made from a specific mix of materials, including epoxy resin and rubber-modified epoxy resin. Additionally, he has developed a method for making multilayer printed wiring boards, which involves a detailed process of adhering copper foils, masking, etching, and pressing under heat. This method allows for the creation of complex circuits through repeated steps.

Career Highlights

Teturoh Satoh is currently employed at Mitsui Mining & Smelting Company, Ltd. His work at this company has allowed him to focus on the development of advanced materials and processes for electronic applications. His expertise in multilayer printed wiring boards has positioned him as a key figure in the industry.

Collaborations

Some of Satoh's coworkers include Muneo Saida and Muneharu Ohara. Their collaboration has contributed to the innovative projects at Mitsui Mining & Smelting Company, Ltd.

Conclusion

Teturoh Satoh's contributions to the field of multilayer printed wiring boards demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and processes that are essential for modern electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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