The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1998
Filed:
Aug. 17, 1995
Applicant:
Inventors:
Assignee:
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29846 ; 29830 ; 174258 ;
Abstract
A process for preparing said multilayer printed wiring board comprising the steps of (1) adhering copper foils respectively to both the faces of a substrate, masking and etching said foils in a usual way to form circuits, (2) applying copper foils having a semi-cured insulating layer formed on one face thereof respectively to said circuits with the insulating layer facing to said circuit, the insulating layers being as defined above, and then pressing the whole together under heat and (3) masking and etching the copper foils with the insulating layer thereon in a usual way to form circuits, the steps (2) and (3) being repeated as many times as desired.