Saitama, Japan

Tetsuya Yonemoto

This inventor holds 1 USPTO granted patent. Top assignee: Sony Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuya Yonemoto. Retrieved from https://idiyas.com/inventor/tetsuya-yonemoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 17.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Tetsuya Yonemoto: Innovator in Electronics Packaging

Introduction

Tetsuya Yonemoto is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of electronics packaging, particularly through his innovative patent that enhances the efficiency of electronic device mounting systems.

Latest Patents

Yonemoto holds a patent for a "System for mounting electronic device." This electronics packaging system includes a printer, a placing unit, and a reflow unit. The system allows a printed wiring board to be carried in an upright position while having solder printed on all lands simultaneously. Electronic parts are placed and soldered to the lands at the same time, resulting in a more compact design and reduced packaging time.

Career Highlights

Tetsuya Yonemoto is currently employed at Sony Corporation, where he continues to develop innovative solutions in electronics. His work has been instrumental in advancing the efficiency of electronic device manufacturing.

Collaborations

Some of his notable coworkers include Mitsuo Inoue and Toshio Toyama, who have collaborated with him on various projects within the company.

Conclusion

Tetsuya Yonemoto's contributions to electronics packaging demonstrate his commitment to innovation and efficiency in the industry. His patent reflects a significant advancement in the way electronic devices are mounted, showcasing his expertise and creativity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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