Fujisawa, Japan

Tetsuya Urakawa



Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Kanagawa-Ken, JP (2015)
  • Fujisawa, JP (2010 - 2020)

Company Filing History:


Years Active: 2010-2020

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9 patents (USPTO):Explore Patents

Title: Tetsuya Urakawa: Innovator in Gasket Technology

Introduction

Tetsuya Urakawa is a prominent inventor based in Fujisawa, Japan. He has made significant contributions to the field of gasket technology, holding a total of nine patents. His innovative approaches have enhanced the manufacturing processes and applications of gaskets, particularly in fuel cell technology.

Latest Patents

Among his latest patents is a method of manufacturing a substrate-integrated gasket. This method utilizes screen printing to form a coating layer of a paste on a substrate's surface. The process includes hardening the coating layer by pressing a correction member to achieve a highly accurate cross-sectional shape. Another notable patent focuses on improving the handling properties of rubber-only gaskets. This invention combines a gasket body with a carrier sheet, allowing for better affixability to attachment positions, particularly in fuel cell applications.

Career Highlights

Tetsuya Urakawa is associated with Nok Corporation, a company known for its advancements in sealing technologies. His work has been instrumental in developing innovative solutions that address the challenges faced in gasket applications. His patents reflect a commitment to enhancing product performance and reliability.

Collaborations

Tetsuya has collaborated with notable colleagues, including Yoshihiro Kurano and Takayuki Horimoto. Their combined expertise has contributed to the successful development of various gasket technologies.

Conclusion

Tetsuya Urakawa's contributions to gasket technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative methods continue to shape the future of gasket manufacturing and applications.

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