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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9895835 B1

PDFFull Text
Date of Patent:
Feb. 20, 2018

Filed:

Mar. 20, 2014

Molding apparatus

Applicant:

Nok Corporation, Tokyo, JP;

Inventors:

Shotaro Koga, Fujisawa, JP;

Tetsuya Urakawa, Fujisawa, JP;

Takeshi Masaka, Fujisawa, JP;

Yoshihiro Kurano, Fujisawa, JP;

Shigeru Watanabe, Fujisawa, JP;

Toshihiro Shimazoe, Fujisawa, JP;

Assignee:

NOK Corporation, , JP;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Ryan Ochylski

Int. Cl.
CPC ...
B29C 45/27 (2006.01); B29C 45/14 (2006.01); B29C 45/17 (2006.01); B29C 45/28 (2006.01); B29C 33/34 (2006.01); B29C 45/04 (2006.01); H01M 8/0284 (2016.01); H01M 8/0286 (2016.01); B29C 33/38 (2006.01); B29C 45/00 (2006.01); B29C 45/32 (2006.01); B29C 45/64 (2006.01); B29L 31/26 (2006.01); B29C 45/06 (2006.01); B29L 31/34 (2006.01); H01M 8/0273 (2016.01); B29K 21/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/2756 (2013.01); B29C 33/34 (2013.01); B29C 33/38 (2013.01); B29C 45/0001 (2013.01); B29C 45/0025 (2013.01); B29C 45/0416 (2013.01); B29C 45/14336 (2013.01); B29C 45/1759 (2013.01); B29C 45/28 (2013.01); B29C 45/32 (2013.01); B29C 45/64 (2013.01); H01M 8/0284 (2013.01); H01M 8/0286 (2013.01); B29C 45/06 (2013.01); B29C 2045/067 (2013.01); B29K 2021/00 (2013.01); B29K 2905/00 (2013.01); B29L 2031/265 (2013.01); B29L 2031/3468 (2013.01); H01M 8/0273 (2013.01);
Abstract

In order to achieve lower costs in a molding apparatus using a mold by reducing mold cleaning steps following releasing of the product from the mold and shortening the molding cycle, the apparatus is equipped with a plurality of fixed molds and movable molds which are heated to the temperature necessary to harden a molding material and come together by means of clamping to form a cavity, and a non-heated cold runner which supplies the molding material from an injection device to the interior of the cavity via a gate opened in the movable mold, the fixed molds and movable molds being movable between an injection stage where the injection device and cold runner () are present and an opening stage near the injection stage.

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