Tetsuya Sugimoto

Title: Tetsuya Sugimoto: Innovator in Semiconductor Technology

Introduction

Tetsuya Sugimoto is a notable inventor based in Aizuwakamatsu, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to lead frame materials.

Latest Patents

Tetsuya Sugimoto holds a patent for a lead frame material and lead frame for semiconductor devices. This invention comprises a base plate made of copper or copper alloys, with a protective coating applied to the surface. The protective coating consists of at least one metal selected from gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, with a thickness ranging from 10 to 500 angstroms. The coating is formed using vapor deposition techniques. Additionally, an intermediate coating of nickel or nickel alloys can be applied between the base plate and the protective coating, with a suitable thickness of 50 to 20,000 angstroms.

Career Highlights

Tetsuya Sugimoto is associated with Mitsubishi Shindoh Co., Ltd., where he has been instrumental in advancing semiconductor materials. His work has contributed to the development of more efficient and reliable semiconductor devices.

Collaborations

Tetsuya has collaborated with notable colleagues such as Shunji Takahashi and Seizo Masukawa, enhancing the innovation process within his field.

Conclusion

Tetsuya Sugimoto's contributions to semiconductor technology through his patent on lead frame materials exemplify his innovative spirit and dedication to advancing the industry. His work continues to influence the development of semiconductor devices, showcasing the importance of innovation in technology.