The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 1996
Filed:
Apr. 26, 1994
Shunji Takahashi, Aizuwakamatsu, JP;
Seizo Masukawa, Aizuwakamatsu, JP;
Rensei Futatsuka, Aizuwakamatsu, JP;
Tetsuya Sugimoto, Aizuwakamatsu, JP;
Takeshi SUzuki, Aizuwakamatsu, JP;
Chuzo Azuma, Aizuwakamatsu, JP;
Yuichi Kanda, Aizuwakamatsu, JP;
Takao Fukatami, Aizuwakamatsu, JP;
Mitsubishi Shindoh Co., Ltd., Tokyo, JP;
Abstract
A lead frame material comprises a base plate consisting of copper or copper alloys, and a protective coating formed on the upper or the both surface of the base plate. The protective coating is composed of at least one metal selected from the group consisting of gold, gold alloy, silver, silver alloy, palladium and palladium alloy, and has a thickness of 10-500 angstrom. The protective coating is formed by means of vapor deposition. It is possible to form an intermediate coating of nickel or nickel alloys between the surface of the base plate and the protective coating, by means of vapor deposition or wet plating. The suitable thickness of the intermediate coating is within the range of 50-20000 angstrom.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile