Company Filing History:
Years Active: 1996
Title: Chuzo Azuma: Innovator in Semiconductor Technology
Introduction
Chuzo Azuma is a notable inventor based in Aizuwakamatsu, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to lead frame materials.
Latest Patents
Chuzo Azuma holds a patent for a lead frame material and lead frame for semiconductor devices. This invention comprises a base plate made of copper or copper alloys, with a protective coating applied to the surface. The protective coating consists of at least one metal selected from gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, with a thickness ranging from 10 to 500 angstroms. The coating is formed using vapor deposition techniques. Additionally, an intermediate coating of nickel or nickel alloys can be applied between the base plate and the protective coating, with a suitable thickness of 50 to 20,000 angstroms.
Career Highlights
Chuzo Azuma is associated with Mitsubishi Shindoh Co., Ltd., where he has been instrumental in advancing semiconductor materials. His work has contributed to the development of more efficient and reliable semiconductor devices.
Collaborations
Throughout his career, Chuzo Azuma has collaborated with notable colleagues, including Shunji Takahashi and Seizo Masukawa. These collaborations have further enhanced the innovation and application of semiconductor technologies.
Conclusion
Chuzo Azuma's contributions to semiconductor technology through his patent on lead frame materials highlight his role as an innovator in the field. His work continues to influence advancements in semiconductor devices, showcasing the importance of innovation in technology.