Tokyo, Japan

Tetsuya Oshita

This inventor holds 1 USPTO granted patent. Top assignee: Clariant Finance (Bvi) Limited. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuya Oshita. Retrieved from https://idiyas.com/inventor/tetsuya-oshita

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Tetsuya Oshita - Innovator in Wafer Technology

Introduction

Tetsuya Oshita is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of semiconductor manufacturing, particularly in the area of wafer processing. His work has significantly impacted the efficiency and quality of polished wafers used in various applications.

Latest Patents

Oshita holds a patent for a "Wafer holding ring for chemical and mechanical polisher." This invention is designed to hold a wafer securely on a chemical mechanical polishing apparatus. The wafer-holding ring prevents damage to the wafer, possesses excellent abrasion resistance, and reduces the need for frequent replacements. This innovation facilitates mass production of polished wafers, enhancing productivity in semiconductor manufacturing.

Career Highlights

Tetsuya Oshita is currently employed at Clariant Finance (Bvi) Limited, where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise in materials science and engineering has led to advancements that benefit the manufacturing process of wafers.

Collaborations

Oshita has collaborated with notable colleagues, including Masami Aizawa and Katsuyuki Sakamoto. Their combined efforts have contributed to the development of innovative solutions in wafer technology.

Conclusion

Tetsuya Oshita's contributions to the field of semiconductor manufacturing through his patented innovations demonstrate his commitment to advancing technology. His work continues to influence the industry, ensuring the production of high-quality polished wafers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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