The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6896602 B1

PDF
Full Text
Expired
Date of Patent:
May. 24, 2005

Filed:

May. 08, 2002
Applicants:

Tetsuya Oshita, Tokyo, JP;

Masami Aizawa, Tokyo, JP;

Katsuyuki Sakamoto, Tokyo, JP;

Inventors:

Tetsuya Oshita, Tokyo, JP;

Masami Aizawa, Tokyo, JP;

Katsuyuki Sakamoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B047/02 ;
U.S. Cl.
CPC ...
Abstract

Disclosed is a wafer-holding ring adapted for holding a wafer on a chemical mechanical polishing apparatus, which can prevent damage to a wafer, possesses excellent abrasion resistance, and can reduce replacement work and consequently can realize mass production of polished wafers. In the wafer-holding ring for a chemical mechanical polishing apparatus, the surface of the wafer-holding ring at least in its portion, which can come into contact with a wafer, is formed of a resin composition comprising not less than 30% by weight of polybenzimidazole.


Find Patent Forward Citations

Oshita, Tetsuya. (2005). Wafer holding ring for chemical and mechanical polisher (U.S. Patent No. 6896602). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6896602

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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