Location History:
- Tokyo, JP (1991)
- Souka, JP (1992)
- Shoka, JP (1994)
Company Filing History:
Years Active: 1991-1994
Title: Tetsuya Okuno: Innovator in Solder Reflow Furnace Technology
Introduction
Tetsuya Okuno is a notable inventor based in Souka, Japan. He has made significant contributions to the field of solder reflow furnace technology, holding a total of 3 patents. His work focuses on improving the efficiency and effectiveness of soldering processes in electronics manufacturing.
Latest Patents
One of Okuno's latest patents is a solder reflow furnace that includes piping to supply an inert gas into the furnace. This design maintains an inert gas atmosphere within the furnace and features a cooling zone adjacent to the main heating zone. The cooling zone is equipped with a gas cooling device that cools printed circuit boards after soldering using an inert cooling gas, which is indirectly cooled by outside air, preventing air from entering the furnace.
Another significant patent involves a reflow furnace with a tunnel through which a conveyor for printed circuit boards passes. This design incorporates multiple pairs of panel-type blowers that can blow hot gas. The blowers are strategically positioned above and below the conveyor, allowing for simultaneous heating of both sides of the printed circuit board when it is present between a pair of blowers.
Career Highlights
Tetsuya Okuno has dedicated his career to advancing soldering technology. His innovative designs have improved the reliability and quality of soldering in electronic components. He works at Senju Metal Industry Co., Ltd., a company known for its expertise in soldering materials and equipment.
Collaborations
Okuno collaborates with Takashi Nauchi, a fellow innovator in the field. Their partnership has led to the development of cutting-edge technologies that enhance the soldering process.
Conclusion
Tetsuya Okuno's contributions to solder reflow furnace technology demonstrate his commitment to innovation in the electronics manufacturing industry. His patents reflect a deep understanding of the challenges in soldering processes and provide effective solutions to improve efficiency and quality.