The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1994
Filed:
May. 17, 1993
Applicant:
Inventors:
Tetsuya Okuno, Shoka, JP;
Takashi Nauchi, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27B / ;
U.S. Cl.
CPC ...
266105 ; 432152 ;
Abstract
A solder reflow furnace includes piping to supply an inert gas into the furnace to maintain an inert gas atmosphere within the furnace and a cooling zone provided next to a main heating zone. The cooling zone is provided with a gas cooling device in which printed circuit boards after soldering are cooled by an inert cooling gas which is in turn cooled indirectly by air outside the furnace so that air is prevented from flowing into the furnace.