This inventor holds 1 USPTO granted patent. Top assignee: Senju Metal Industry Co., Ltd.. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005
Title: Tetsuya Okuno: Innovator in Lead-Free Solder Technology
Introduction
Tetsuya Okuno is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of solder technology, particularly with his innovative approach to lead-free solder paste.
Latest Patents
Okuno holds a patent for a lead-free solder paste suitable for reflow soldering. This solder paste comprises a mixture of various types of metal powders combined with a flux. One of the key components is a Sn alloy powder, while other metal powders may include elemental Ag, elemental Cu, and elemental Sn. The composition of these metal powders, when melted, consists of 1-5 mass % Ag, 0.5-3 mass % Cu, and the remainder being Sn. This innovation addresses the growing demand for environmentally friendly soldering solutions.
Career Highlights
Tetsuya Okuno is associated with Senju Metal Industry Co., Ltd., where he has been instrumental in developing advanced solder materials. His work has contributed to the company's reputation as a leader in solder technology.
Collaborations
Okuno has collaborated with notable colleagues such as Toshihiko Taguchi and Satoru Akita. These partnerships have fostered innovation and enhanced the development of new soldering materials.
Conclusion
Tetsuya Okuno's contributions to lead-free solder technology exemplify his commitment to innovation in the field. His patent and collaborations highlight the importance of developing sustainable solutions in manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile