The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2005
Filed:
May. 27, 2004
Toshihiko Taguchi, Saitama, JP;
Satoru Akita, Sohka, JP;
Masato Shimamura, Sohka, JP;
Ryoichi Suzuki, Saratoga, CA (US);
Tetsuya Okuno, San Jose, CA (US);
Toshihiko Taguchi, Saitama, JP;
Satoru Akita, Sohka, JP;
Masato Shimamura, Sohka, JP;
Ryoichi Suzuki, Saratoga, CA (US);
Tetsuya Okuno, San Jose, CA (US);
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
A lead-free solder paste suitable for reflow soldering includes a plurality of different types of metal powder mixed with a flux. One of the metal powders is a Sn alloy powder. Another of the metal powders is selected from a Sn alloy powder, elemental Ag powder, elemental Cu powder, and elemental Sn powder. Each Sn alloy powder includes 0-8 mass % of Ag, 0-5 mass % of Cu, and at least 80 mass % of Sn. The plurality of metal powders have a composition when melted of 1-5 mass % Ag, 0.5-3 mass % Cu, and a remainder of Sn.