Company Filing History:
Years Active: 2016-2025
Title: Tetsuya Maki: Innovator in Bonding Technology
Introduction
Tetsuya Maki is a prominent inventor based in Koshi, Japan. He has made significant contributions to the field of bonding technology, holding a total of 3 patents. His innovative work has advanced the methods and apparatus used in substrate bonding processes.
Latest Patents
Maki's latest patents include a bonding apparatus and bonding method. This bonding apparatus features a first holder and a second holder, along with a first interferometer, housing, gas supply, and airflow control cover. The first holder attracts and holds the first substrate, while the second holder does the same for the second substrate. The first interferometer measures the distance to the second holder or a first object moved along with the second holder. The housing accommodates the first holder, second holder, and first interferometer, while the gas supply provides gas into the housing. The airflow control cover redirects part of the gas flow toward the light path.
Another notable patent is the substrate positioning apparatus, which includes a holder and a rotating device. The holder is designed to hold a substrate, and the rotating device is configured to rotate the holder. This device consists of a rotation shaft, bearing member, base member, driving unit, and damping device. The damping device produces a damping force against the relative operation between the rotation shaft and the base member.
Career Highlights
Tetsuya Maki is currently employed at Tokyo Electron Limited, a leading company in the semiconductor and electronics manufacturing industry. His work at this company has allowed him to focus on developing advanced bonding technologies that are crucial for modern electronics.
Collaborations
Maki has collaborated with notable coworkers, including Tatsumi Oonishi and Toshifumi Inamasu. Their combined expertise has contributed to the successful development of innovative bonding solutions.
Conclusion
Tetsuya Maki's contributions to bonding technology through his patents and work at Tokyo Electron Limited highlight his role as a key innovator in the field. His advancements continue to influence the electronics industry and improve bonding methods.