The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2025

Filed:

May. 23, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Tetsuya Maki, Koshi, JP;

Tatsumi Oonishi, Koshi, JP;

Toshifumi Inamasu, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 2224/751 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/83093 (2013.01); H01L 2224/8313 (2013.01); H01L 2224/83894 (2013.01);
Abstract

A bonding apparatus includes a first holder, a second holder, a first interferometer, a housing, a gas supply and an airflow control cover. The first holder attracts and holds the first substrate. The second holder attracts and holds the second substrate. The first interferometer measures, by radiating light to the second holder or a first object which is moved along with the second holder in the first horizontal direction, a distance to the second holder or the first object in the first horizontal direction. The housing accommodates therein the first holder, the second holder and the first interferometer. The gas supply is provided at a lateral side of the housing, and supplies a gas into the housing. The airflow control cover is provided within the housing, and redirects a part of a flow of the gas supplied from the gas supply toward a first path of the light.


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