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Tetsuya Hirose

USPTO Granted Patents = 11 (Patent Applications = 1)

EPO Patents = 10 (Patent Applications = 12)

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 71(Granted Patents)

Location History:

Hitaka, JP (1988 - 1992)
Osaka, JP (2014)
Ibaraki, JP (2012 - 2023)

Company Filing History:

Nitto-denko Corporation

Junkosha Co., Ltd.

Years Active: 1988-2024

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12095243 - Supporting member, conduit supporting device, and processing apparatus provided therewith (2024-09-17),

2. 11721966 - Supporting member, conduit supporting device, and processing apparatus provided therewith (2023-08-08),

3. 11329470 - Supporting member, conduit supporting device, and processing apparatus provided therewith (2022-05-10),

4. 10472545 - Sealing sheet (2019-11-12),

5. 9896606 - Pressure-sensitive adhesive sheet and use thereof (2018-02-20),

6. 9605189 - Pressure-sensitive adhesive composition (2017-03-28),

7. 8828539 - Acrylic pressure-sensitive adhesive, acrylic pressure-sensitive adhesive layer and acrylic pressure-sensitive adhesive tape or sheet (2014-09-09),

8. 8771602 - Resin production apparatus and resin production method (2014-07-08),

9. 8299182 - Acrylic pressure-sensitive adhesive composition and acrylic pressure-sensitive adhesive tape (2012-10-30),

10. 5136123 - Multilayer circuit board (1992-08-04),

11. 4781969 - Flexible printed circuit board (1988-11-01),

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