The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2017
Filed:
Jul. 09, 2014
Applicant:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Inventors:
Tetsuya Hirose, Ibaraki, JP;
Shinji Inokuchi, Ibaraki, JP;
Kenichi Nishikawa, Ibaraki, JP;
Takayuki Shimada, Sayama, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08G 61/04 (2006.01); C09J 133/14 (2006.01); C08F 220/18 (2006.01); C09J 4/00 (2006.01);
U.S. Cl.
CPC ...
C09J 133/14 (2013.01); C08F 220/18 (2013.01); C09J 4/00 (2013.01);
Abstract
A pressure-sensitive adhesive composition is provided for forming an acrylic pressure-sensitive adhesive that constitutes an adhesive face. The pressure-sensitive adhesive composition comprises an amino group-containing (meth)acrylate as its monomeric component. The amino group-containing (meth)acrylate accounts for 5% by mass or more of all monomeric components of the pressure-sensitive adhesive composition.