Otsu, Japan

Tetsuya Abe

This inventor holds 1 USPTO granted patent. Top assignee: Toray Engineering Company, Limited. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuya Abe. Retrieved from https://idiyas.com/inventor/tetsuya-abe-kqscga2k

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Tetsuya Abe - Innovator in Haptic Technology

Introduction

Tetsuya Abe is a notable inventor based in Otsu, Japan. He has made significant contributions to the field of haptic technology, particularly through his innovative patent that enhances user interaction with devices.

Latest Patents

Tetsuya Abe holds a patent for an operational feeling reproduction device. This device includes an operation component, an actuator, and a drive shaft. The actuator generates a haptic drive force in response to the operation of the operation component. The drive shaft couples the operation component and the actuator, allowing the haptic drive force to be transmitted effectively. This technology enables users to experience actual operational feelings, enhancing the interaction with various devices.

Career Highlights

Tetsuya Abe is currently employed at Toray Engineering Company, Limited, where he continues to develop innovative technologies. His work focuses on creating devices that improve user experience through advanced haptic feedback mechanisms.

Collaborations

Tetsuya collaborates with Chisa Inaka, contributing to the development of cutting-edge technologies in their field.

Conclusion

Tetsuya Abe's contributions to haptic technology through his patent and work at Toray Engineering Company, Limited highlight his role as an influential inventor in the industry. His innovations pave the way for enhanced user experiences in various applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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