Tetsuro Iwakura

Title: Tetsuro Iwakura: Innovator in Semiconductor Technology

Introduction

Tetsuro Iwakura is a notable inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to adhesive sheets used in semiconductor devices.

Latest Patents

Iwakura holds a patent for an adhesive sheet, semiconductor device, and process for producing a semiconductor device. The objective of this invention is to provide an adhesive sheet that effectively fills irregularities caused by wiring on a substrate or wires attached to semiconductor chips. This adhesive sheet is designed to prevent resin burrs during dicing while offering excellent heat and moisture resistance. The invention comprises a resin that includes a high molecular weight component with a weight-average molecular weight of 100,000 or greater and a glass transition temperature (Tg) ranging from -50°C to 50°C. Additionally, it contains a thermosetting component primarily made of epoxy resin and a filler, with the adhesive sheet having a thickness between 10 to 250 micrometers.

Career Highlights

Tetsuro Iwakura is associated with Hitachi Chemical Company, Ltd., where he has been able to apply his expertise in semiconductor technology. His work has contributed to advancements in the production and efficiency of semiconductor devices.

Collaborations

Iwakura has collaborated with notable colleagues such as Teiichi Inada and Michio Mashino, enhancing the innovation process within his field.

Conclusion

Tetsuro Iwakura's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the development of efficient and effective semiconductor devices.