The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Apr. 20, 2005
Teiichi Inada, Tsukuba, JP;
Michio Mashino, Chiba, JP;
Michio Uruno, Chiba, JP;
Tetsuro Iwakura, Tsukuba, JP;
Teiichi Inada, Tsukuba, JP;
Michio Mashino, Chiba, JP;
Michio Uruno, Chiba, JP;
Tetsuro Iwakura, Tsukuba, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of −50° C. to 50° C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 μm.