Chichibu, Japan

Tetsuo Kubota

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Showa Denko K.k.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tetsuo Kubota. Retrieved from https://idiyas.com/inventor/tetsuo-kubota-2zsb2ei0

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile



Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2012

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2 patents (USPTO):Explore Patents

Title: Tetsuo Kubota: Innovator in Solder Circuit Board Technology

Introduction

Tetsuo Kubota is a notable inventor based in Chichibu, Japan. He has made significant contributions to the field of electronic circuit board technology. With a total of 2 patents to his name, Kubota's work focuses on innovative methods for producing solder circuit boards.

Latest Patents

Kubota's latest patents include a production method for solder circuit boards. This method involves imparting tackiness to a surface of a conductive circuit electrode on a printed wiring board. The process includes depositing solder powder on the tackiness-imparted area and heating the board to melt the solder, thereby forming a solder circuit. Additionally, he has developed a method for the attachment of solder powder to electronic circuit boards. This method treats an exposed metallic surface with a tackifier compound to create a tackified part, allowing for the attachment of solder powder through a dry or wet process.

Career Highlights

Tetsuo Kubota is currently employed at Showa Denko K.K., where he continues to innovate in the field of electronic components. His work has been instrumental in advancing solder circuit board technology, which is crucial for modern electronics.

Collaborations

Kubota has collaborated with notable coworkers, including Takashi Shoji and Takekazu Sakai. Their combined expertise contributes to the innovative environment at Showa Denko K.K.

Conclusion

Tetsuo Kubota's contributions to solder circuit board technology exemplify his commitment to innovation in electronics. His patents reflect a deep understanding of the complexities involved in electronic circuit design and manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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