The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Jan. 11, 2008
Applicants:
Takashi Shoji, Tokyo, JP;
Takekazu Sakai, Tokyo, JP;
Tetsuo Kubota, Chichibu, JP;
Inventors:
Assignee:
Showa Denko K.K., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
Shoji, Takashi. (2012). Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board (U.S. Patent No. 8109432). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8109432
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile