This inventor holds 3 USPTO granted patents. Top assignee: Tokuyama Corporation. Active years: 2003-2015.
Location History:
- Tokuyama, JP (2003)
- Yamaguchi, JP (2012 - 2015)
Company Filing History:
Years Active: 2003-2015
Title: **Innovative Contributions of Tetsuo Imai in Circuit Substrate Technology**
Introduction
Tetsuo Imai is a prominent inventor based in Yamaguchi, Japan, recognized for his significant contributions to the field of circuit substrate technology. With a total of three patents to his name, Imai has demonstrated exceptional innovation in the methods of manufacturing and enhancing plated circuit substrates.
Latest Patents
Imai's recent patents include breakthrough technologies such as the **Plating method of circuit substrate**, **Production method of plated circuit substrate**, and **Silver etching liquid**. His plating method involves a series of precise steps:
1. Treating the circuit substrate with a first liquid agent containing an oxidizing agent.
2. Subsequently, treating it with a second liquid agent that dissolves copper oxide, effectively cleaning the conductive pattern's surface.
3. The third step employs a liquid agent that dissolves silver oxide at a significantly faster rate than copper, ensuring that silver oxide is removed efficiently.
4. Finally, this process culminates in electroless plating on the circuit substrate's conductive pattern.
In addition, his patent concerning the **Metallized substrate** provides a comprehensive structure comprised of a ceramics substrate layered with various metal coatings, ensuring enhanced connection strength even under heat stress from semiconductor chips.
Career Highlights
Tetsuo Imai serves as an inventor with Tokuyama Corporation, where he has utilized his expertise to push the boundaries of circuit substrate technology. His innovative methods contribute to the reliability and effectiveness of electronic components in various applications.
Collaborations
Throughout his career, Imai has collaborated with notable colleagues such as Osamu Yatabe and Masakatsu Maeda. These partnerships have enabled the sharing of knowledge and expertise, further advancing the field and fostering a collaborative environment that encourages innovation.
Conclusion
Tetsuo Imai's work exemplifies the critical role of inventors in driving technological advancement. His patents reflect a deep understanding of materials and processes essential for the development of robust circuit substrates. As technology continues to evolve, innovations like those of Imai will undoubtedly play a significant part in shaping the future of electronic manufacturing.