Katano, Japan

Tetsuo Fukushima


Average Co-Inventor Count = 3.5

ph-index = 9

Forward Citations = 223(Granted Patents)


Location History:

  • Osaka, JP (1991)
  • Hirakata, JP (1990 - 1992)
  • Katano, JP (1992 - 2002)

Company Filing History:


Years Active: 1990-2002

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16 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Tetsuo Fukushima

Introduction

Tetsuo Fukushima, hailing from Katano, Japan, has established himself as a notable inventor with a commendable portfolio of 16 patents. His innovative work primarily focuses on materials used in electronics, specifically in the field of soldering, vital for the assembly of electronic components.

Latest Patents

Fukushima's latest patents include a unique solder and solder paste designed to effectively solder electronic parts to circuit boards. This innovative solder consists of 2.0 to 3.5 wt % of silver (Ag), 5 to 18 wt % of bismuth (Bi), with tin (Sn) making up the remainder. Additionally, he explores compositions that incorporate elements such as indium (In), copper (Cu), and zinc (Zn) to enhance the performance of the solder. Another significant patent involves a lead-free soldering alloy, primarily composed of tin and enriched with small quantities of silver for improved thermal fatigue resistance, bismuth for lowered melting points, and copper to control intermetallic growth at the bonding interface. The incorporation of indium further enhances the alloy's elongation properties and resilience.

Career Highlights

Fukushima has had a distinguished career, including significant tenures at Matsushita Electric Industrial Co., Ltd., now known as Panasonic Corporation, where he leveraged his expertise in soldering materials to advance electronic assembly technologies.

Collaborations

Throughout his career, Tetsuo Fukushima has collaborated with esteemed colleagues such as Kenichiro Suetsugu and Junji Ikeda. Their combined efforts have played a crucial role in the development of innovative solder materials that meet the evolving demands of the electronics industry.

Conclusion

Tetsuo Fukushima's contributions to solder technology exemplify the spirit of innovation that drives progress in the electronics sector. Through his patents, he has not only improved the performance and safety of solder materials but has also set a benchmark for future research and development in the field. His work is a testament to the importance of continuous improvement and innovation in technology.

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