Matsushita Electric Industrial Co., Ltd.

Matshushita Electric Industrial Co., Ltd.

Tetsuo Fukushima

Kenichiro Suetsugu

Atsushi Yamaguchi

Junji Ikeda

Munekazu Nishihara

Akio Furusawa

Takao Inoue

Tokuhito Hamane

Yukio Maeda

Koichi Yoshida

Kazumi Ishimoto

Toshinori Otsuki

Keinosuke Kanashima

Kenji Fukumoto

Shinji Okada

Masato Tanida

Kenichiro Seutsugu

Jyunji Ikeda

Yakeshi Yoshii

Kazumi Nishimura

Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.

Solder, solder paste and soldering method

The present invention relates to a soldering alloy composed mainly of Sn and free from lead, a toxic substance. Adding a small quantity of Ag to the soldering alloy can make the alloy structure fine, minimize structural changes of the alloy and increase its thermal fatigue resistance. Adding a small quantity of Bi to the soldering alloy lowers the melting point and improves the alloy's wettability. Further, adding a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.

Soldering alloy, cream solder and soldering method

Process for manufacturing a resin-encapsulated electronic product

Solder, electronic component mounted by soldering, and electronic

The present invention relates to a soldering alloy composed mainly of Sn and free from lead which is a toxic substance. An addition of a small quantity of Ag to the soldering alloy can fine the alloy structure, minimize structural changes of the alloy and increase thermal fatigue resistance thereof. An addition of a small quantity of Bi to the soldering alloy lowers the melting point and improves the wettability thereof. Further, an addition of a small quantity of Cu restrains the growth of intermetallic compounds in the bonding interface between a copper land and the solder. Furthermore, an addition of a small quantity of In improves the elongation property and thermal fatigue resistance of the alloy.

An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.

Electronic circuit substrate

An image reading device includes: a light emitting element for irradiating light on an image surface; a light receiving element for receiving image information in the form of reflected light from the image surface; and light waveguide passages provided between the light emitting element and the image surface and between the light receiving element and the image surface, respectively, and at least the light waveguide passage for the light emitting element is widened at an end surface thereof at the image surface to a width wider than at the end surface at the light emitting element.

Image reading device having a light waveguide means widened toward an

Disclosed is an image sensor including a circuit board, an array of light emitting elements for emitting light to an image plane, an array of light receiving elements for receiving image information transmitted by reflected light from the image plane, and plural pairs of light wave guides interposed between the light emitting elements and the image plane and between the image plane and the light receiving elements. Both the light emitting elements and the light receiving elements are mounted on the same surface of the circuit board.

Image sensor having light guides for communication with image plane

A method for molding an article integrated with a multi-layer flexible circuit by embedding the circuit in a molding material to be shaped into a certain configuration. A first flexible circuit layer is sandwiched between a fixed mold and a movable mold so as to perform an injection shaping of one side of the molding material. A plurality of flexible circuits from the second layer of flexible circuit and subsequent flexible circuits are sequentially sandwiched between the fixed mold and the movable mold and they are layered one on the other. The movable mold contains a heater. The pattern of each flexible circuit is traced with thermosetting conductive paste which is hardened by the heater of the movable mold when flexible circuits are laminated on each other. Each flexible circuit has a hot-melt type adhesive layer on the rear surface thereof. The adhesive layer is melted by the heater of the movable mold so as to place each flexible circuit layer in position when flexible circuits are laminated on each other. Through-holes are formed by punching and conductive paste is charged into the through-holes with the last layer of flexible circuit sandwiched between the fixed mold and the movable mold. Then, the injection shaping of the other side of the material is carried out.

Method for molding an article integrated with a multi-layer flexible

An optical waveguide device includes a plurality of optical waveguides extending adjacent each other in a sheet-like form. Each of the waveguides includes core portion, an inner cladding layer formed on a periphery of the core portion, and an outer cladding layer formed on a periphery of the inner cladding layer. The inner cladding layer is devoid of light scatterers, whereas the outer cladding layer has light scatterers disposed therein. As light travels within the core portion, such light is efficiently reflected at the surface of the inner cladding layer. The outer cladding layer having the light scatterers disposed therein functions to inhibit crosstalk between adjacent waveguides.

Optical wave guide sheet comprising plurality of doubly-clad core

An optical waveguide and an image sensor using the same, the optical waveguide comprising a plurality of bar-shaped cores that are aligned in a proper manner, the cores being made of transparent materials with a large refractive index, and a cladding that is disposed around the cores, the cladding being made of materials with a small refractive index that are capable of absorbing or scattering light, wherein part of each of said cores on which irradiated light is incident is uncovered, or part of said cladding on which irradiated light is incident is transparent.

Optical waveguide and an image sensor using the same

A bicycle frame comprising a lug and a pipe to be fitted onto a projection at the lug, annular grooves opposite to each other being disposed at the mutual contact surfaces of the lug projection and pipe, wherein an unidirectional form memory alloy changeable of its outer diameter by heating is disposed in one of the opposite annular grooves, and the projection of the lug and the pipe are bonded at the fitting surfaces by means of a thermosetting adhesive, whereby the bicycle frame is high in safety and superior in productivity and has an improved bonding strength and mechanical juncture.

Bicycle frame

In the coating method of a viscous material according to the present invention, a nozzle body having outlets corresponding to many coating rows is employed. The nozzle body is moved, while the gap between the nozzle body and the surface to be coated is maintained constant, so that the viscous material composed of different kinds of materials is discharged out of each outlet, thereby to effect simultaneous coating of the viscous material composed of different kinds of materials in many rows. Therefore, the present invention has such advantages that the surface to be coated is less stained, and at the same time, the surface to be coated becomes more smooth.

Method of applying a coating of viscous materials

A lens array of rod lenses (16), to be used for reading image data in document copier, facsimile, printer, white board scanner, and so on, is made by injection molding of a transparent resin in an already made plastic lens-holding frame (3) having an array of through-holes (2) and gates (1) leading to respective through-holes (2) for injecting melted transparent resin therethrough, both ends of the through-holes having cores (6) and (7) with concave faces.

Growing community of inventors

Katano, Japan

Tetsuo Fukushima