Tetsuaki Kamiya

Title: Tetsuaki Kamiya: Innovator in Multilayer Substrate Technology

Introduction

Tetsuaki Kamiya is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of multilayer substrate technology, holding a total of 4 patents. His innovative approaches have paved the way for advancements in electronic components.

Latest Patents

Kamiya's latest patents focus on the manufacturing method of multilayer substrates. In his first patent, he describes a process where single-sided conductor patterned films are prepared. Each film has a conductor pattern formed on only one side of a resin film, along with a via hole filled with conductive paste. A single-sided conductor patterned film, which has an opening to expose an electrode, is laminated onto these films. Additionally, a cover layer with an opening to expose an electrode is laminated on the bottom surface of the single-sided conductor patterned films to create a laminate. By pressing and heating this laminate, a multilayer substrate with electrodes on both sides can be produced. This innovative method enhances the efficiency and functionality of multilayer substrates.

Career Highlights

Throughout his career, Tetsuaki Kamiya has worked with prominent companies such as Denso Corporation and Nippondenso Co., Ltd. His experience in these organizations has contributed to his expertise in the field of electronics and substrate manufacturing.

Collaborations

Kamiya has collaborated with notable colleagues, including Shoji Miura and Makio Iida. These partnerships have further enriched his work and led to advancements in multilayer substrate technology.

Conclusion

Tetsuaki Kamiya's contributions to multilayer substrate technology through his patents and collaborations highlight his role as an influential inventor in the electronics industry. His innovative methods continue to impact the development of advanced electronic components.