Tokyo, Japan

Teppei Sotoda

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Tokyo, JP (2017)
  • Tokyo-to, JP (2021)

Company Filing History:


Years Active: 2017-2024

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4 patents (USPTO):Explore Patents

Title: Teppei Sotoda: Innovator in Semiconductor Technology

Introduction

Teppei Sotoda is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative wiring structures and methods that enhance the performance and efficiency of semiconductor devices.

Latest Patents

Sotoda's latest patents include a variety of advanced technologies. These patents encompass a wiring structure and method of manufacturing the same, a semiconductor device, a multilayer wiring structure and method of manufacturing the same, and a semiconductor element mounting substrate. Additionally, he has developed methods for forming pattern structures, imprint molds, and multilayer wiring boards. One notable patent describes a mold that includes a base material and a rugged structure on its main surface. This rugged structure features linearly shaped projected portions for wiring and a circularly shaped projected portion for forming a pad. A light-shielding layer is integrated at the top flat surface of the circularly shaped projected portion, enhancing its functionality.

Career Highlights

Sotoda is currently employed at Dai Nippon Printing Co., Ltd., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in various electronic devices.

Collaborations

Throughout his career, Teppei Sotoda has collaborated with notable colleagues, including Ryohei Kasai and Tadashi Furukawa. These partnerships have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Teppei Sotoda is a key figure in semiconductor innovation, with a focus on improving wiring structures and manufacturing methods. His contributions are shaping the future of technology in this critical field.

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