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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12144120 B1

PDFFull Text
Date of Patent:
Nov. 12, 2024

Filed:

Oct. 20, 2021

Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Ryohei Kasai, Tokyo-to, JP;

Tadashi Furukawa, Tokyo-to, JP;

Ryo Furugen, Tokyo-to, JP;

Teppei Sotoda, Tokyo-to, JP;

Tetsushi Hosoda, Tokyo-to, JP;

Ayako Furuse, Tokyo-to, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo-to, JP;

Attorney:

Oliff PLC

Primary Examiner:

Daniel McNally

Int. Cl.
CPC ...
H05K 3/00 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); H01L 21/481 (2013.01); H01L 21/4846 (2013.01); H01L 21/768 (2013.01); H01L 23/498 (2013.01); H01L 23/544 (2013.01); H05K 3/0023 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 23/49822 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/0376 (2013.01);
Abstract

A mold includes a mold base material and a rugged structure located at a main surface of the mold base material. The rugged structure includes a plurality of linearly shaped projected portions for forming wiring, and a circularly shaped projected portion for forming a pad portion, in which a light-shielding layer is provided at a top portion flat surface of the circularly shaped projected portion for forming the pad portion.

Find Patent Forward Citations

Kasai, Ryohei. (2024). Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board (U.S. Patent No. 12144120). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12144120

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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