Company Filing History:
Years Active: 2021-2024
Title: Ryo Furugen: Innovator in Semiconductor Technology
Introduction
Ryo Furugen is a prominent inventor based in Tokyo-to, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on advanced wiring structures and manufacturing methods that enhance the performance and efficiency of semiconductor devices.
Latest Patents
Furugen's latest patents include innovative designs such as a wiring structure and method of manufacturing the same, as well as a multilayer wiring structure and method of manufacturing the same. His patents also cover semiconductor element mounting substrates and methods for forming pattern structures. Notably, one of his inventions involves an imprint mold that includes a mold base material and a rugged structure located at the main surface of the mold base material. This rugged structure features a plurality of linearly shaped projected portions for forming wiring, along with a circularly shaped projected portion for forming a pad portion. A light-shielding layer is provided at the top portion flat surface of the circularly shaped projected portion for forming the pad portion.
Career Highlights
Furugen is currently employed at Dai Nippon Printing Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing new methods that improve the manufacturing processes of semiconductor devices.
Collaborations
Throughout his career, Ryo Furugen has collaborated with notable colleagues, including Ryohei Kasai and Tadashi Furukawa. These partnerships have fostered innovation and contributed to the advancement of their shared field.
Conclusion
Ryo Furugen stands out as a key figure in semiconductor innovation, with a focus on developing advanced wiring structures and manufacturing techniques. His contributions are shaping the future of technology in this critical area.