Dai Nippon Printing Co., Ltd.

Teppei Sotoda

Gen Furui

Junya Eguchi

Shoichiro Ogumi

Tadashi Furukawa

Ryohei Kasai

Ayako Furuse

Tetsushi Hosoda

Kousuke Matsuyama

Ryo Furugen

A mold includes a mold base material and a rugged structure located at a main surface of the mold base material. The rugged structure includes a plurality of linearly shaped projected portions for forming wiring, and a circularly shaped projected portion for forming a pad portion, in which a light-shielding layer is provided at a top portion flat surface of the circularly shaped projected portion for forming the pad portion.

Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring board

An antiglare film, including: a light transmissive substrate; and an antiglare layer that is disposed on a light transmissive substrate and includes a concavo-convex surface, wherein a surface of the antiglare film is a concavo-convex surface; the antiglare film has a total haze value of 0% or more and 5% or less; the antiglare film has an internal haze value of 0% or more and 5% or less; and assuming that a transmission image sharpness of the antiglare film, measured using an optical comb with a width of 0.125 mm, is C (0.125), and that a transmission image sharpness of the antiglare film, measured using an optical comb with a width of 0.25 mm, is C (0.25), an expression (1) and an expression (2) described below are satisfied:(0.25)&#x2212;(0.125)&#x2267;2%&#x2003;&#x2003;(1); and(0.125)&#x2267;65%&#x2003;&#x2003;(2).

Anti-glare film, polarizer, liquid-crystal panel, and image display device

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Tokyo, Japan

Teppei Sotoda